[Editorial] Rocking the World With Advanced Package Technology

The “Past Moore” Period: Pushing the Boundaries of Semiconductors

Previously, the technological development on this planet of semiconductors revolved round who may make smaller transistors and match extra on a single chip. Gordon Moore predicted that the density of transistors on a chip doubles each 24 months — the well-known “Moore’s Legislation”. Though it has gone by means of some changes over historical past to replicate the pace of technological progress, “Moore’s Legislation” has been thought-about the basic precept of semiconductor expertise growth for the final 5 many years.

Right this moment’s period of smartphones, cell web, AI and massive information requires more and more quicker speeds of computing efficiency. Nonetheless, the pace of semiconductor innovation and expertise development has slowed down, and chip miniaturization has reached bodily limits, which has prompted the pace at which transistors are rising smaller to decelerate. In different phrases, we at the moment are falling behind Moore’s Legislation.

The market additionally calls for semiconductors to be versatile, encompassing a wide range of options corresponding to analog or RF wi-fi communication in a single chip. However because the semiconductor course of turns into more and more miniaturized, it will get more and more troublesome to keep up analog efficiency. It’s certainly turning into troublesome to handle the wants of the market simply by means of course of miniaturization based mostly on Moore’s Legislation.

In an effort to overcome these limitations of semiconductor expertise, an strategy that goes past the prevailing Moore’s Legislation is required, and we name this “Past Moore”.

“Superior Package deal, Main the Past Moore Period”

Our reply to the Past Moore period is Superior Package deal expertise. By superior Heterogeneous Integration, which connects a number of chips horizontally and vertically, extra transistors could be planted on a single chip (or package deal) and provide efficiency that’s extra highly effective than the sum of all elements.

Based on market analysis, the CAGR of the superior packaging {industry} is estimated at 9.6% progress fee between 2021 and 2027. In truth, 2.5D1 and 3D packages2 implementing heterogeneous integration is predicted to point out a good larger progress fee of 14%.

Governments are additionally paying shut consideration. The South Korean Ministry of Commerce, Business and Vitality hosted a discussion board on semiconductor packaging expertise in February, whereas DARPA (Protection Superior Analysis Initiatives Company) of the US Division of Protection introduced the allocation of a large-scale finances for superior package-related fields final April. The Japanese authorities additionally introduced new incentives to draw analysis facilities, in addition to establishing a devoted symposium.

“One-Cease Superior Package deal Resolution with Excessive Efficiency and Low Energy”

In a bid to handle the rising significance of superior packaging expertise, Samsung Electronics established the AVP (AdVanced Package deal) Enterprise Group below the Machine Options Division final December to spice up the corporate’s capabilities in superior packaging expertise and maximize the synergy between enterprise items.

Samsung Electronics, with industry-leading experience in reminiscence, logic foundry and package deal enterprise, is well-positioned to make the most of heterogeneous integration to supply aggressive 2.5D and 3D packages that join state-of-the-art logic semiconductors produced with EUV and high-performance reminiscence semiconductors corresponding to HBM.

The AVP Enterprise Group operates below a enterprise mannequin that gives one-stop superior package deal options that allow high-performance and low-power options. We talk carefully and straight with prospects as a way to present options tailor-made to the wants of every buyer and product. Our focus areas are the event of next-generation 2.5D and 3D superior package deal options based mostly on RDL,3 Si Interposer/Bridge4 and TSV5 stacking applied sciences.

“Our Future Past Connection”

The objective of the AVP Enterprise Group is “hyper-connection” (or “hyper-integration”). “Hyper-connection” is greater than a easy sum of the efficiency and capabilities of every semiconductor. We envision making a better synergy that connects semiconductors to the world, connects folks to folks and connects prospects’ imaginations to actuality.

Samsung Electronics is dedicated to a aggressive growth and manufacturing technique, with proprietary packaging expertise suitable with the large-area development. Based mostly on customer-oriented enterprise growth that ensures immediate responses to buyer requests, the AVP Enterprise Group will deliver merchandise of creativeness to actuality.

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